等待開盤 12-19 09:30:00 美东时间
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Key HighlightsRevenues: €16.9 million for the six months ended June 30, 2025 compared to €29.7 million for the same period last year due to lower order volumes in Asia, Europe and the USAGross Profit: €-1.7 million for
12-17 22:24
The SCHMID Group, a leading global provider of equipment and solutions for the electronics industry, today announced the successful delivery and installation of its first InfinityLine C+ system for a leading Japanese
12-02 22:58
Gainers Data I/O (NASDAQ:DAIO) shares increased by 14.1% to $2.84 during Tuesd...
11-19 05:06
On November 12, 2025, SCHMID Group N.V. ("SCHMID" or the "Company") received a staff determination letter (the "Determination Letter") from the staff of the Listing Qualifications Department of The Nasdaq Stock Market
11-18 01:01
SCHMID Group (NASDAQ:SHMD), a global equipment maker and solution provider for Printed Circuit Boards (PCB) and IC-Substrate manufacturing, today announced the successful acquisition of two significant orders in the
11-10 19:22
SCHMID Group shares are trading higher after the company secured major orders f...
10-22 19:37
SCHMID Group announced securing two major orders for AI server PCB production equipment. One project involves delivering wet-process equipment, while the other supplies horizontal H+ machines, marking expansion into new markets. The orders reflect confidence in SCHMID’s technology, with one customer entrusting them with a full production line. This highlights SCHMID’s pivotal role in the growing AI-driven semiconductor industry, emphasizing their...
10-22 11:31
Gainers Veritone (NASDAQ:VERI) stock increased by 51.1% to $8.25 during Wednes...
10-16 01:06
FREUDENSTADT, Germany, Oct. 08, 2025 (GLOBE NEWSWIRE) -- SCHMID Group, a leading global provider of equipment and solutions for the electronics industry, announces a major expansion of its product portfolio to meet the
10-08 22:29
SCHMID Group launched its first InfinityLine P+ system, a panel-level plating equipment with integrated photoresist stripping, offering modern, efficient, and low-maintenance solutions for Advanced Substrate and Panel Level Packaging manufacturers. The system features touch-free, double-sided vertical cluster plating, segmented and moveable anodes for uniform copper distribution, DI-water-cooled titanium contacts for thin seed layers, and seamles...
10-08 14:42