库力索法半导体 KLIC 深沪

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34.98

+2.870

+8.94%

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最高35.12
今开34.54
成交量 107.15万股
最低 32.8022
昨收 32.11
总市值 18.46亿
52周最高 51.465
市盈率 ^静 --
换手率 2.03%
52周最低 26.42
委比 -72.22%
总股本 5276.93万
历史最高 72.295
量比 1.64
振幅 7.22%
历史最低 2.095
每手 1
风险率 5.87%

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UPDATE: Kulicke & Soffa Indus Sees Q4 GAAP EPS $0.07-$0.09 vs $0.04 Est

Kulicke & Soffa Indus (NASDAQ:KLIC) is looking for Q4 GAAP EPS of $0.07-$0.09 vs $0.04 analyst estimate..

08-07 07:02
Earnings Scheduled For August 6, 2025

Companies Reporting Before The Bell • Lineage (NASDAQ:LINE) is likely to report...

08-06 16:33
A Look at Axcelis Technologies's Upcoming Earnings Report

Axcelis Technologies (NASDAQ:ACLS) is preparing to release its quarterly earnin...

08-05 00:03
Shares of several semiconductor stocks are trading lower in possible sympathy with ASML, which said it cannot confirm its growth outlook for 2026 and cited macro uncertainty.

Shares of several semiconductor stocks are trading lower in possible sympathy w...

07-16 23:49
Kulicke & Soffa And Lavorro Partner To Deliver AI-Powered Smart Manufacturing Solutions For Semiconductor Industry

Empowering Semiconductor Manufacturers with Actionable Insight, Solution Advising, and Expert Knowledge Capture for Scalable OperationsSINGAPORE, July 9, 2025 /PRNewswire/ -- Kulicke and Soffa

07-09 21:06
Kulicke & Soffa Ends Facility Agreements with MUFG

Kulicke & Soffa ( ($KLIC) ) has shared an update. On June 6, 2025, Kulicke ...

06-09 22:58
Kulicke and Soffa declares $0.205 dividend

Kulicke and Soffa (NASDAQ:KLIC) declares $0.205/share quarterly dividend, in line with previous. Forward yield 2.45% Payable July 8; for shareholders of record June 19; ex-div June 19. See KLIC Divide...

06-05 21:11
Kulicke & Soffa Declares Quarterly Dividend of $0.205

SINGAPORE, June 5, 2025 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa," "K&S" or the "Company"), today announced that its Board of Directors has approve...

06-05 21:05
Shares of several semiconductor companies are trading higher amid GlobalFoundries' announcement to commit $16 billion towards US chip expansion, which may be buoying investor sentiment towards the space.

Shares of several semiconductor companies are trading higher amid GlobalFoundri...

06-05 02:32
HBM的「暗战」

原标题：HBM的「暗战」 2024年，HBM成为半导体产业最炙手可热的产品之一。随着AI大模型和高性能计算的狂飙突进，英伟达等巨头对HBM的需求水涨船高，内...

05-19 09:26

派息除权日	每股总股息	派息日期
2025-06-18	0.20	2025-07-08
2025-03-20	0.20	2025-04-08
2024-12-19	0.20	2025-01-07
2024-09-19	0.20	2024-10-08
2024-06-20	0.20	2024-07-09
2024-03-22	0.20	2024-04-09
2023-12-20	0.20	2024-01-09
2023-09-20	0.19	2023-10-10
2023-06-21	0.19	2023-07-10
2023-03-22	0.19	2023-04-10
2022-12-21	0.19	2023-01-09
2022-09-21	0.17	2022-10-09
2022-06-22	0.17	2022-07-11
2022-03-23	0.17	2022-04-11
2021-12-22	0.17	2022-01-10
2021-09-22	0.14	2021-10-12
2021-06-23	0.14	2021-07-12
2021-03-24	0.14	2021-04-12
2020-12-23	0.14	2021-01-11
2020-09-24	0.12	2020-10-13
2020-06-25	0.12	2020-07-13
2020-03-26	0.12	2020-04-13
2019-12-26	0.12	2020-01-13
2019-09-26	0.12	2019-10-14
2019-06-27	0.12	2019-07-15
2019-03-27	0.12	2019-04-15
2018-12-26	0.12	2019-01-14
2018-09-26	0.12	2018-10-15
2018-06-27	0.12	2018-07-16
1985-06-10	0.04	1985-07-08
1985-03-11	0.04	1985-04-08
1984-12-10	0.04	1985-01-07
1984-09-10	0.02	1984-10-08
1984-06-11	0.02	1984-07-09
1984-03-12	0.02	1984-04-09
1983-12-12	0.02	1984-01-16
1983-09-27	0.02	1983-10-17
1983-07-01	0.02	1983-07-19
1983-03-14	0.04	1983-04-08
1982-12-13	0.04	1983-01-14
1982-09-27	0.04	1982-10-15
1982-06-29	0.04	1982-07-16
1982-03-15	0.04	1982-04-09
1982-01-12	0.04	1982-01-18
1981-09-21	0.04	1981-10-09
1981-06-22	0.04	1981-07-10
1981-03-16	0.04	1981-04-10
1980-12-29	0.04	1981-01-19
1980-09-24	0.08	1980-10-17
1980-06-16	0.08	1980-07-11
1980-03-23	0.08	1980-04-10
1979-12-20	0.08	1980-01-10
1979-09-23	0.08	1979-10-09
1978-09-04	0.25	1978-09-28

公司名称	库力索法半导体
行业分类	半导体制造
业务描述	Kulicke & Soffa Industries, Inc. engages in the design, manufacture, and sale of semiconductor and electronics assembly solutions. The firm operates through the Ball Bonding Equipment, Wedge Bonding Equipment, Advanced Solutions, and Aftermarket Products and Services (APS) segments. The Ball Bonding Equipment segment involves the design, development, manufacture and sale of wafer level bonding equipment. The APS segment includes the variety of tools, spares and services for the equipment. The company was founded by Frederick W. Kulicke and Albert Soffa in 1951 and is headquartered in Fort Washington, PA.

库力索法半导体 KLIC 深 沪

34.98

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库力索法半导体 KLIC 深沪