三星可能会建造芯片包装工厂：报道

2026-06-09 20:49

Samsung (SSNLF) is looking into building a chip packaging plant in South Korea, Korean news outlet Economic Daily reported.
The facility could be in the South Jeolla and Gwangju areas of the country, notable given that Sk hynix (HXSCL) is also considering an investment in the area.
The South Korean technology giant is conducting a final review of the plan, and it could be unveiled as soon as next month, the news outlet added, citing sources familiar with the matter.
A semiconductor packaging plant in Gwangju would be feasible, given that the city recently created a “semiconductor cluster development master plan,” the news outlet added. The plant would likely receive government support, the Economic Daily added, likely via the Special Semiconductor Act, which is set to go into effect in August.
Samsung did not immediately respond to a request for comment from Seeking Alpha.

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