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随着英特尔EMIB-T的进步，联合微电子可能会受益：Wedbush
2026-08-05 20:48
- United Microelectronics (UMC) could be a prime beneficiary of Intel's (INTC) Embedded Multi-die Interconnect Bridge chip packaging technology, Wedbush Securities said.
- Citing a TrendForce report that Powerchip Semiconductor Manufacturing has entered Intel's EMIB-T supply chain, Wedbush analyst Matt Bryson noted that United Microelectronics could manufacture the silicon bridges embedded in Intel's EMIB substrates.
- "Given INTC's seeming success gaining early traction with EMIB, if this news is accurate, we would see these developments as positive for UMC and PSMC," Bryson said in a report to clients.
- Earlier this week, Taiwan semiconductor firm MediaTek stated Intel's Embedded Multi-die Interconnect Bridge chip packaging technology had reached a “very good level,” which Wedbush said could indicate a deal with Google (GOOG) (GOOGL) is near.
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