韦德布什：英特尔EMIB收益率达到“非常好的水平”可能意味着谷歌交易

2026-08-04 21:11

Taiwan semiconductor firm MediaTek stated that Intel's (INTC) Embedded Multi-die Interconnect Bridge chip packaging technology has reached a “very good level.” Wedbush Securities believes this could be further indication a deal with Google (GOOG) (GOOGL) is near.
“While it has been anticipated that Google TPUs would use Intel EMIB, this news appears to fully confirm prior speculation, with Mediatek's comments on yield further validating Intel's progress on packaging,” Wedbush analyst Matt Bryson wrote in a note to clients. “Finally, we would note that Mediatek's commentary also suggests the ASIC designer is seeing improved traction with Google with management during last week's call having raised its 2027 AI ASIC share target to 15-20% from 10-15%.”
Intel CEO Lip Bu-Tan said last month that its foundry unit had signed a deal with its first external customer, Fortinet (FTNT).

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